• Three Variable-Output Voltage Step-Down Controllers
  • Wide VIN Range From 5.4 V to 21 V
  • Up to 5-A Output Current for BUCK1 (VNN), 7-A for BUCK6 (VDDQ), and 21-A for BUCK2 (VCCGI) Using External FETs
  • I2C DVS Control (0.5 V to 1.45 V in 10-mV Steps) for BUCK1 and BUCK2
  • OTP-Programmable Default Output Voltage for BUCK6 (VDDQ)
• Three Variable-Output Voltage Synchronous Step-Down Converters
  • VIN Range From 4.5 V to 5.5 V
  • Up to 3 A of Output Current for BUCK3 (VCCRAM) With I2C DVS Control (0.65 V to 1.45 V in 25-mV Steps)
  • Up to 1.5 A of Output Current for BUCK4 (V1P8A) and BUCK5 (V1P24A)
• Three LDO Regulators With Adjustable Output Voltage
  • LDOA1: I2C-Selectable Output Voltage From 1.35 V to 3.3 V for up to 200 mA of Output Current
  • LDOA2 and LDOA3: I2C-Selectable Output Voltage From 0.7 V to 1.5 V for up to 600 mA of Output Current
• VTT LDO for DDR3 and DDR4 Memory Termination
• Three Load Switches With Slew Rate Control
  • Up to 300 mA of Output Current With Voltage Drop Less Than 1.5% of Nominal Input Voltage
  • RDSON < 96 mΩ at Input Voltage of 1.8 V
• I2C Interface (Device Address 0x5E) Supports Standard Mode (100 kHz), Fast Mode (400 kHz), and Fast Mode Plus (1 MHz)
• 64-Pin, Single-Row, 0.4-mm Pitch QFN Package

• 2-, 3-, or 4-Series Cell Li-Ion Battery Powered Products (NVDC or Non-NVDC)
• Tablet, Ultrabook, and Notebook Computers
• Mobile PCs and Mobile Internet Devices

The TPS650941 device is a single-chip solution, power-management IC designed specifically for the latest Intel™ processors targeted for tablets, ultrabooks, and notebooks with NVDC or non-NVDC power architectures, using 2S, 3S, or 4S Li-Ion battery packs. The TPS650941 device is used for essential systems with low-voltage rails merged for the smallest footprint and lowest-cost system-power solution. The TPS650941 device provides the complete power solution based on the Intel Reference Designs. Six highly efficient step-down voltage regulators (VRs), a sink or source LDO (VTT), and a load switch are controlled by power-up sequence logic to provide the proper power rails, sequencing, and protection—including DDR3 and DDR4 memory power. The two regulators (BUCK1–BUCK2) support dynamic voltage scaling (DVS) for maximum efficiency—including support for Connected Standby. The high-frequency VRs use small inductors and capacitors to achieve a small solution size. An I2C interface allows simple control by an embedded controller (EC) or by a system on chip (SoC). The PMIC comes in an 8-mm × 8-mm single-row QFN package with a thermal pad for good thermal dissipation and ease of board routing.

Use the following email address to request the full version of this data sheet: ipgmkt@list.ti.com.