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TI产品 - 74ACT16823介绍

74ACT16823 - 具有三态输出的 18 位总线接口触发器

74ACT16823是TI德州仪器公司的一款D类触发器产品，74ACT16823是具有三态输出的 18 位总线接口触发器，本站介绍了74ACT16823的封装应用图解、特点和优点、功能等，并给出了与74ACT16823相关的TI元器件型号供参考。

74ACT16823 - 具有三态输出的 18 位总线接口触发器 - D类触发器 - 触发器/锁存器/寄存器 - 德州仪器

产品描述

These 18-bit flip-flops feature 3-state outputs designed specifically for driving highly-capacitive or relatively low-impedance loads. They are particularly suitable for implementing wider buffer registers, I/O ports, parity bus interfacing, and working registers.

The 'ACT16823 can be used as two 9-bit flip-flops or one 18-bit flip-flop. With the clock-enable () input low, the D-type flip-flops enter data on the low-to-high transitions of the clock. Taking high disables the clock buffer, thus latching the outputs. Taking the clear () input low causes the Q outputs to go low independently of the clock.

A buffered output-enable () input can be used to place the outputs in either a normal logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly.

does not affect the internal operation of the flip-flops. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

The 74ACT16823 is packaged in theTI shrink small-outline package, which provides twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area.

The 54ACT16823 is characterized for operation over the full military temperature range of 55°C to 125°C. The 74ACT16823 is characterized for operation from -40°C to 85°C

产品特性

  • Members of the Texas Instruments WidebusTM Family
  • Inputs Are TTL-Voltage Compatible
  • Provide Extra Data Width Necessary for Wider Address/Data Paths or Buses With Parity
  • Flow-Through Architecture Optimizes PCB Layout
  • Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
  • EPICTM (Enhanced-Performance Implanted CMOS) 1-m Process
  • Package Options Include Plastic 300-mil Shrink Small-Outline (DL) Packages Using 25-mil Center-to-Center Pin Spacings and 380-mil Fine-Pitch Ceramic Flat (WD) Packages Using 25-mil Center-to-Center Pin Spacings

EPIC and Widebus are trademarks of Texas Instruments Incorporated.

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