ADC12D1600RF - 12 位、2.0/3.2 GSPS 射频采样 ADC

ADC12D1600RF是TI德州仪器公司的一款高速模数转换器(>=1GSPS)产品，ADC12D1600RF是12 位、2.0/3.2 GSPS 射频采样 ADC，本站介绍了ADC12D1600RF的封装应用图解、特点和优点、功能等，并给出了与ADC12D1600RF相关的TI元器件型号供参考。

ADC12D1600RF - 12 位、2.0/3.2 GSPS 射频采样 ADC - 高速模数转换器(>=1GSPS) - 模数转换器 - 德州仪器

1 Device Overview

1.1 Features

Excellent Noise and Linearity up to and Above fIN = 2.7 GHz
Configurable to Either 3.2 or 2 GSPS Interleaved or 1600 or 1000 MSPS Dual ADC
New DESCLKIQ Mode for High Bandwidth, High Sampling Rate Apps
Pin-Compatible With ADC10D1x00, ADC12D1x00
AutoSync Feature for Multi-Chip Synchronization
Internally Terminated, Buffered, Differential Analog Inputs
Interleaved Timing Automatic and Manual Skew Adjust
Test Patterns at Output for System Debug
Time Stamp Feature to Capture External Trigger
Programmable Gain, Offset, and tAD Adjust Feature
1:1 Non-Demuxed or 1:2 Demuxed LVDS Outputs
Key Specifications
- Resolution 12 Bits
- Interleaved 3.2- and 2-GSPS ADC
  - IMD3 (Fin = 2.7 GHz at –13 dBFS) –63.7/–73 dBFS (Typical)
  - IMD3 (Fin = 2.7 GHz at –16 dBFS) –66.7/–85 dBFS (Typical)
  - Noise Floor –154.6/–154 dBm/Hz (Typical)
  - Power 3.94/3.42 W (Typical)
- Dual 1600/1000 MSPS ADC, Fin = 498 MHz
  - ENOB 9.2/9.4 Bits (Typical)
  - SNR 58.2/58.8 dB (Typical)
  - SFDR 66.7/71.9 dBc (Typical)
  - Power per Channel 1.97/1.71 W (Typical)

1.2 Applications

3G/4G Wireless Basestations
- Receive Path
- DPD Path
Wideband Microwave Backhaul
RF Sampling Software Defined Radios
Military Communications
SIGINT
RADAR and LIDAR
Wideband Communications
Consumer RFs
Tests and Measurements

1.3 Description

The 12-bit 3.2- and 2-GSPS ADC12D1x00RF is an RF-sampling GSPS ADC that can directly sample input frequencies up to and above 2.7 GHz. The ADC12D1x00RF augments the very large Nyquist zone of TI’s GSPS ADCs with excellent noise and linearity performance at RF frequencies, extending its usable range beyond the 3rd Nyquist zone

The ADC12D1x00RF provides a flexible LVDS interface which has multiple SPI programmable options to facilitate board design and FPGA/ASIC data capture. The LVDS outputs are compatible with IEEE 1596.3-1996 and supports programmable common-mode voltage. The product is packaged in a lead-free 292-ball thermally enhanced BGA package over the rated industrial temperature range of –40°C to 85°C.

产品器件信息

PART NUMBER	PACKAGE	BODY SIZE
ADC12D1000RF	BGA (40)	27.00 mm × 27.00 mm
ADC12D1600RF	BGA (40)	27.00 mm × 27.00 mm

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