• Configurable to Either 3.6 GSPS Interleaved or 1.8 GSPS Dual ADC
• Pin-Compatible with ADC10D1000/1500 and ADC12D1000/1600
• Internally Terminated, Buffered, Differential Analog Inputs
• Interleaved Timing Automatic and Manual Skew Adjust
• Test Patterns at Output for System Debug
• Programmable 15-bit Gain and 12-bit Plus Sign Offset
• Programmable tAD Adjust Feature
• 1:1 Non-Demuxed or 1:2 Demuxed LVDS Outputs
• AutoSync Feature for Multi-Chip Systems
• Single 1.9-V ± 0.1-V Power Supply
• Key Specifications
  • Resolution: 12 Bits
  • Interleaved 3.6 GSPS ADC
    • Noise Floor Density –153.5 dBm/Hz (typ)
    • IMD3 –61 dBFS (typ)
    • Noise Power Ratio 48.5 dB (typ)
    • Power 4.4 W (typ)
    • Full Power Bandwidth 1.75 GHz (typ)
  • Dual 1.8 GSPS ADC, Fin = 125MHz
    • ENOB: 9.4 (typ)
    • SNR 58.5 dB (typ)
    • SFDR 73 dBc (typ)
    • Power 4.4 W (typ)
    • Full Power Bandwidth 2.8 GHz (typ)

• Wideband Communications
• Data Acquisition Systems
• RADAR/LIDAR
• Set-top Box
• Consumer RF
• Software Defined Radio

The 12-bit, 3.6 GSPS ADC12D1800 is the latest advance in TI's Ultra-High-Speed ADC family and builds upon the features, architecture and functionality of the 10-bit GHz family of ADCs.

The ADC12D1800 provides a flexible LVDS interface which has multiple SPI programmable options to facilitate board design and FPGA/ASIC data capture. The LVDS outputs are compatible with IEEE 1596.3-1996 and supports programmable common mode voltage.

The product is packaged in a leaded or lead-free 292-ball thermally enhanced BGA package over the rated industrial temperature range of –40°C to +85°C.

To achieve full rated performance for fCLK > 1.6 GHz, write the maximum power settings one time to Register 6h through the serial interface; see Section 5.6.1 for more information.