SN74ABT823 - 具有三态输出的 9 位总线接口触发器

SN74ABT823是TI德州仪器公司的一款D类触发器产品，SN74ABT823是具有三态输出的 9 位总线接口触发器，本站介绍了SN74ABT823的封装应用图解、特点和优点、功能等，并给出了与SN74ABT823相关的TI元器件型号供参考。

SN74ABT823 - 具有三态输出的 9 位总线接口触发器 - D类触发器 - 触发器/锁存器/寄存器 - 德州仪器

产品描述

These 9-bit flip-flops feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing wider buffer registers, I/O ports, bidirectional bus drivers with parity, and working registers.

With the clock-enable (CLKEN\) input low, the nine D-type edge-triggered flip-flops enter data on the low-to-high transitions of the clock. Taking CLKEN\ high disables the clock buffer, thus latching the outputs. Taking the clear (CLR\) input low causes the nine Q outputs to go low, independently of the clock.

A buffered output-enable (OE\) input can be used to place the nine outputs in either a normal logic state (high or low logic level) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without need for interface or pullup components.

When VCC is between 0 and 2.1 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 2.1 V, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN54ABT823 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT823 is characterized for operation from -40°C to 85°C.

产品特性

State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation
ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
High-Impedance State During Power Up and Power Down
High-Drive Outputs (-32-mA IOH, 64-mA IOL)
Buffered Control Inputs to Reduce dc Loading Effects
Package Options Include Plastic Small-Outline (DW) and Shrink Small-Outline (DB) Packages, Ceramic Chip Carriers (FK) and Flatpacks (W), and Standard Plastic (NT) and Ceramic (JT) DIPs

EPIC-IIB is a trademark of Texas Instruments Incorporated.

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