SN74AHCT16374 - 具有三态输出的 16 位边沿 D 类触发器

SN74AHCT16374是TI德州仪器公司的一款D类触发器产品，SN74AHCT16374是具有三态输出的 16 位边沿 D 类触发器，本站介绍了SN74AHCT16374的封装应用图解、特点和优点、功能等，并给出了与SN74AHCT16374相关的TI元器件型号供参考。

SN74AHCT16374 - 具有三态输出的 16 位边沿 D 类触发器 - D类触发器 - 触发器/锁存器/寄存器 - 德州仪器

产品描述

The 'AHCT16374 devices are 16-bit edge-triggered D-type flip-flops with 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

These devices can be used as two 8-bit flip-flops or one 16-bit flip-flop. On the positive transition of the clock (CLK) input, the Q outputs of the flip-flop take on the logic levels at the data (D) inputs.

A buffered output-enable (OE\) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines without need for interface or pullup components.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

OE\ does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

The SN54AHCT16374 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74AHCT16374 is characterized for operation from -40°C to 85°C.

产品特性

Members of the Texas Instruments WidebusTM Family
EPICTM (Enhanced-Performance Implanted CMOS) Process
Inputs Are TTL-Voltage Compatible
Distributed VCC and GND Pins Minimize High-Speed Switching Noise
Flow-Through Architecture Optimizes PCB Layout
Latch-Up Performance Exceeds 250 mA Per JESD 17
ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings

EPIC and Widebus are trademarks of Texas Instruments Incorporated.

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