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THS1408-EP - 产品图解:
THS1408-EP-增强型产品 14 位 8Msps Adc,单通道,差动 输入、Dsp/Up If、可编程增益放大器
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TI产品 - THS1408-EP介绍
THS1408-EP - 增强型产品 14 位 8Msps Adc,单通道,差动 输入、Dsp/Up If、可编程增益放大器

THS1408-EP是TI公司的一款精密ADC(<=10MSPS)产品,THS1408-EP是增强型产品 14 位 8Msps Adc,单通道,差动 输入、Dsp/Up If、可编程增益放大器,本页介绍了THS1408-EP的产品说明、应用、特性等,并给出了与THS1408-EP相关的TI元器件型号供参考。

THS1408-EP - 增强型产品 14 位 8Msps Adc,单通道,差动 输入、Dsp/Up If、可编程增益放大器 - 精密ADC(<=10MSPS) - 模数转换器 - TI公司(Texas Instruments,德州仪器)

产品描述

The THS1408 is a 14-bit, 3/8-MSPS single-supply analog-to-digital converter (ADC), with an internal reference, differential inputs, programmable input gain, and an on-chip sample and hold amplifier.

Implemented with a CMOS process, the device has outstanding price/performance and power/speed ratios. The THS1408 is designed for use with 3.3-V systems, and with a high-speed µP-compatible parallel interface, making it the first choice for solutions based on high-performance DSPs like the TI TMS320C6000 series.

产品特性

  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance up to –55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product Change Notification
  • Qualification Pedigree(1)
  • 14-Bit Resolution
  • 3- and 8-MSPS Speed Grade
  • Differential Nonlinearity (DNL) ±0.6 LSB Typ
  • Integral Nonlinearity (INL) ±1.5 LSB Typ
  • Internal Reference
  • Differential Inputs
  • Programmable Gain Amplifier
  • µP-Compatible Parallel Interface
  • Timing Compatible With TMS320C6000 DSP
  • 3.3-V Single Supply
  • Power-Down Mode
  • Monolithic CMOS Design
  • Applications
    • xDSL Front Ends
    • Communication
    • Industrial Control
    • Instrumentation
    • Automotive and Selected Military

(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

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