TLV5638-EP是TI公司的一款精密DAC(=<10MSPS)产品，TLV5638-EP是增强型塑料 12 位 1Us 串行输入双路 Dac，具有可编程内部 基准和建立时间，本页介绍了TLV5638-EP的产品说明、应用、特性等，并给出了与TLV5638-EP相关的TI元器件型号供参考。
TLV5638-EP - 增强型塑料 12 位 1Us 串行输入双路 Dac，具有可编程内部 基准和建立时间 - 精密DAC(=<10MSPS) - 数模转换器 - TI公司（Texas Instruments，德州仪器）
The TLV5638 is a dual 12-bit voltage output DAC with a flexible 3-wire serial interface. The serial interface allows glueless interface to TMS320 and SPI™, QSPI™, and Microwire™ serial ports. It is programmed with a 16-bit serial string containing 4 control and 12 data bits.
The resistor string output voltage is buffered by a x2 gain rail-to-rail output buffer. The buffer features a Class AB output stage to improve stability and reduce settling time. The programmable settling time of the DAC allows the designer to optimize speed vs power dissipation. With its on-chip programmable precision voltage reference, the TLV5638 simplifies overall system design.
Because of its ability to source up to 1 mA, the reference can also be used as a system reference. Implemented with a CMOS process, the device is designed for single supply operation from 2.7 V to 5.5 V. It is available in an 8-pin SOIC package to reduce board space.
- Controlled Baseline
- One Assembly/Test Site, One Fabrication Site
- Extended Temperature Performance of –55°C to 125°C
- Enhanced Diminishing Manufacturing Sources (DMS) Support
- Enhanced Product Change Notification
- Qualification Pedigree
- Dual 12-Bit Voltage Output DAC
- Programmable Internal Reference
- Programmable Settling Time: 1 µs in Fast Mode, 3.5 µs in Slow Mode
- Compatible With TMS320 and SPI™ Serial Ports
- Differential Nonlinearity <0.5 LSB Typ
- Monotonic Over Temperature
- applications
- Digital Servo Control Loops
- Digital Offset and Gain Adjustment
- Industrial Process Control
- Machine and Motion Control Devices
- Mass Storage Devices
Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits. SPI and QSPI are trademarks of Motorola, Inc. Microwire is a trademark of National Semiconductor Corporation.
