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TMP006 - 产品图解：
TMP006-采用 WCSP 封装的红外热电堆触点温度传感器
TMP006-红外热电堆温度传感器-温度传感器和控制IC-传感器产品
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TI产品 - TMP006介绍

TMP006 - 采用 WCSP 封装的红外热电堆无触点温度传感器

TMP006是TI德州仪器公司的一款红外热电堆温度传感器产品，TMP006是采用 WCSP 封装的红外热电堆无触点温度传感器，本站介绍了TMP006的封装应用图解、特点和优点、功能等，并给出了与TMP006相关的TI元器件型号供参考。

TMP006 - 采用 WCSP 封装的红外热电堆无触点温度传感器 - 红外热电堆温度传感器 - 温度传感器和控制IC - 德州仪器

产品特性
  • Integrated MEMs Thermopile for Noncontact Temperature Sensing
  • Local Temperature Sensor for Cold Junction Reference
    • ±1°C (max) from 0°C to 60°C
    • ±1.5°C (max) from –40°C to +125°C
  • Two-Wire Serial Interface Options:
    • I2C and SMBus Compatible
      • TMP006 at 3.3 V
      • TMP006B at 1.8 V
    • Eight Programmable Addresses
  • Low Power
    • Supply: 2.2 V to 5.5 V
    • Active Current: 240 μA (typ)
    • 1-µA shutdown (max)
  • Compact Package
    • 1.6-mm × 1.6-mm × 0.625-mm DSBGA
产品应用
  • Noncontact Temperature Sensing
    • Case Temperature
    • Laser Printers
    • Power Relays
    • Health and Beauty
    • HVAC Comfort Optimization
  • Gas Concentration
  • Flame Detection
产品说明

The TMP006 and TMP006B are fully integrated MEMs thermopile sensors that measure the temperature of an object without having to be in direct contact. The thermopile absorbs passive infrared energy from an object at wavelengths between 4 um to 16 um within the end-user defined field of view.

The corresponding change in voltage across the thermopile is digitized and reported with the on-chip die thermal sensor measurement through an I2C- and SMBus-compatible interface. With this data, the target object temperature can be calculated by an external processor.

The TMP007 is an enhanced version of the TMP006 or TMP006B. The TMP007 combines all the features of the TMP006 and TMP006B with an additional math engine to perform all of the equations on chip, allowing the target object temperature to be read directly from the device. The TMP007 also provides built-in nonvolatile memory for storing calibration coefficients.

The Infrared thermopile sensor is specified to operate from –40°C to +125°C. It is possible to measure an object temperature beyond the device operating range as long as the device itself does not exceed the operating temperature range (–40°C to +125°C).

产品器件信息
PART NUMBERPACKAGEBODY SIZE (NOM)
TMP006DSBGA (8)1.60 mm × 1.60 mm
TMP006B
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