TPS3809K33-EP - TPS3809L30-EP, TPS3809K33-EP, TPS3809I50-EP

TPS3809K33-EP是TI德州仪器公司的一款无产品，TPS3809K33-EP是TPS3809L30-EP, TPS3809K33-EP, TPS3809I50-EP，本站介绍了TPS3809K33-EP的封装应用图解、特点和优点、功能等，并给出了与TPS3809K33-EP相关的TI元器件型号供参考。

TPS3809K33-EP - TPS3809L30-EP, TPS3809K33-EP, TPS3809I50-EP - 无 - 监控器和复位IC - 德州仪器

产品描述

The TPS3809 family of supervisory circuits provides circuit initialization and timing supervision, primarily for DSPs and processor-based systems.

During power-on, RESET is asserted when the supply voltage VDD becomes higher than 1.1 V. Thereafter, the supervisory circuit monitors VDD and keeps RESET active as long as VDD remains below the threshold voltage VIT. An internal timer delays the return of the output to the inactive state (high) to ensure proper system reset. The delay time, td(typ) = 200 ms, starts after VDD has risen above the VIT. When the supply voltage drops below the VIT, the output becomes active (low) again. No external components are required. All the devices of this family have a fixed-sense VIT set by an internal voltage divider.

The product spectrum is designed for supply voltages of 2.5 V, 3 V, 3.3 V, and 5 V. The circuits are available in a 3-pin SOT-23 package. The TPS3809 devices are characterized for operation over a temperature range of -55°C to 125°C.

产品特性

Controlled Baseline
- One Assembly Site
- One Test Site
- One Fabrication Site
Extended Temperature Performance of -55°C to 125°C
Enhanced Diminishing Manufacturing Sources (DMS) Support
Enhanced Product-Change Notification
Qualification Pedigree(1)
3-Pin SOT-23 Package
Supply Current of 9 µA (Typical)
Precision Supply Voltage Monitor 2.5 V, 3 V, 3.3 V, 5 V
Power-On Reset Generator With Fixed Delay Time of 200 ms
Pin-for-Pin Compatible With MAX 809

(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

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