TPS82671 - 采用 MicroSiP(TM) 封装的 600mA 完全集成式低噪声降压转换器模块

TPS82671是TI德州仪器公司的一款非隔离式模块产品，TPS82671是采用 MicroSiP(TM) 封装的 600mA 完全集成式低噪声降压转换器模块，本站介绍了TPS82671的封装应用图解、特点和优点、功能等，并给出了与TPS82671相关的TI元器件型号供参考。

TPS82671 - 采用 MicroSiP(TM) 封装的 600mA 完全集成式低噪声降压转换器模块 - 非隔离式模块 - 电源模块 - 德州仪器

产品特性

90% Efficiency at 5.5MHz Operation
17μA Quiescent Current
Wide VIN Range From 2.3V to 4.8V
5.5MHz Regulated Frequency Operation
Spread Spectrum, PWM Frequency Dithering
Best in Class Load and Line Transient
±2% Total DC Voltage Accuracy
Automatic PFM/PWM Mode Switching
Low Ripple Light-Load PFM Mode
≥35dB VIN PSRR (1kHz to 10kHz)
Internal Soft Start, 120-µs Start-Up Time
Integrated Active Power-Down Sequencing (Optional)
Current Overload and Thermal Shutdown Protection
Sub 1-mm Profile Solution
Total Solution Size <6.7 mm2

产品应用

Cell Phones, Smart-Phones
Camera Module, Optical Data Module
Wearable Electronics
Digital TV, WLAN, GPS and Bluetooth™ Applications
POL Applications

产品说明

The TPS8267x device is a complete 600mA, DC/DC step-down power supply intended for low-power applications. Included in the package are the switching regulator, inductor and input/output capacitors. No additional components are required to finish the design.

The TPS8267x is based on a high-frequency synchronous step-down dc-dc converter optimized for battery-powered portable applications. The MicroSiP™ DC/DC converter operates at a regulated 5.5-MHz switching frequency and enters the power-save mode operation at light load currents to maintain high efficiency over the entire load current range.

The PFM mode extends the battery life by reducing the quiescent current to 17μA (typ) during light load operation. For noise-sensitive applications, the device has PWM spread spectrum capability providing a lower noise regulated output, as well as low noise at the input. These features, combined with high PSRR and AC load regulation performance, make this device suitable to replace a linear regulator to obtain better power conversion efficiency.

The TPS8267x is packaged in a compact (2.3mm x 2.9mm) and low profile (1.0mm) BGA package suitable for automated assembly by standard surface mount equipment.

产品器件信息

PART NUMBER	PACKAGE	BODY SIZE (NOM)
TPS8267x	µSIP (8)	2.30 x 2.90 mm

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