66AK2H06 - 多核 ARM+DSP 通信基础设施片上系统 (SOC)

66AK2H06是TI德州仪器公司的一款C6000DSP+ARM处理器产品，66AK2H06是多核 ARM+DSP 通信基础设施片上系统 (SOC)，本站介绍了66AK2H06的封装应用图解、特点和优点、功能等，并给出了与66AK2H06相关的TI元器件型号供参考。

66AK2H06 - 多核 ARM+DSP 通信基础设施片上系统 (SOC) - C6000DSP+ARM处理器 - 数字信号处理器 - 德州仪器

产品描述

The 66AK2Hx platform is TI's first to combine the quad ARM® Cortex™-A15 MPCore™ processors with up to eight TMS320C66x high-performance DSPs using the KeyStone II architecture. Unlike previous ARM Cortex-A15 devices that were designed for consumer products, the 66AK2Hx platform provides up to 5.6 GHz of ARM and 11.2 GHz of DSP processing coupled with security and packet processing and Ethernet switching, all at lower power than multi-chip solutions making it optimal for embedded infrastructure applications like cloud computing, media processing, high-performance computing, transcoding, security, gaming, analytics and virtual desktop. Using TI's heterogeneous programming runtime software and tools, customers can easily develop differentiated products with 66AK2Hx SoCs.

产品特性

CorePac Processors
- Quad or Dual Cortex-A15 processors
- Eight or Four C66x DSP cores
Network AcceleratorPac
- Packet coprocessor (IPv4/IPv6) for Layer 2-4
- Security coprocessor IPSec/SRTP
- Five-port 1-Gb Ethernet switch
Memory
- Cache-coherent Multicore Shared Memory Controller (MSMC)
- 1MB per core Level 2 RAM/cache
- 6MB shared memory with ECC and cache coherency
- Two DDR3/3L 1600 interfaces with ECC
KeyStone II Architecture
- Multicore Navigator; brings single-core programming simplicity to multicore SoCs
- 16,000 atomic hardware queues
- TeraNet - on-chip interconnect providing more than two terabits per second throughput
- Low power - 9-14 Watts at 55°C case temperature
High speed I/O
- PCI Express Gen2-up to 10 Gbps
- Serial RapidIO V2.1-up to 20 Gbps
- USB 3.0
- HyperLink - up to 100 Gbaud for chip-to-chip interconnect
- Three-port 10-Gb Ethernet switch (66AK2H14 only)

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