CC2564MODN - 蓝牙双模式 HCI 模块

CC2564MODN是TI德州仪器公司的一款TI芯片产品，CC2564MODN是蓝牙双模式 HCI 模块，本站介绍了CC2564MODN的封装应用图解、特点和优点、功能等，并给出了与CC2564MODN相关的TI元器件型号供参考。

CC2564MODN - 蓝牙双模式 HCI 模块 - TI芯片 - Bluetooth/蓝牙低耗能 - 德州仪器

1 Device Overview

1.1 Features

Single-Chip Solution Integrating Bluetooth Basic Rate (BR)/Enhanced Data Rate (EDR)/Low Energy (LE) Features
Fully Certified Bluetooth 4.1 Module
- Compliant Up to the HCI Layer
- FCC (Z64-2564N)/IC (451I-2564N) Modular Grant with External Chip Antenna (see Section 6.2.1.3, Antenna)
- CE Certified as Summarized in the Declaration of Conformity
- Bluetooth 4.1 Controller Subsystem Qualified (QDID 55257)
BR/EDR Features Include:
- Up to 7 Active Devices
- Scatternet: Up to 3 Piconets Simultaneously, 1 as Master and 2 as Slaves
- Up to 2 SCO Links on the Same Piconet
- Support for All Voice Air-Coding – Continuously Variable Slope Delta (CVSD), A-Law, μ-Law, and Transparent (Uncoded)
Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
LE Features Include:
- Support of Up to 10 Simultaneous Connections
- Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
- Independent Buffering for LE Allows Large Numbers of Multiple Connections without Affecting BR/EDR Performance.
- Built-In Coexistence and Prioritization Handling for BR/EDR and LE
Flexibility for Easy Stack Integration and Validation Into Various Microcontrollers, Such as MSP430™ and ARM® Cortex®-M3 and Cortex®-M4 MCUs
Highly Optimized for Design into Small Form Factor Systems:
- Single-Ended 50-Ω RF Interface
- Module Footprint: 33 Terminals, 0.9-mm Pitch, 7mmx7mmx1.4 mm
Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
- Class 1.5 TX Power Up to +10 dBm
- –93 dbm Typical RX Sensitivity
- Improved Adaptive Frequency Hopping (AFH) Algorithm with Minimum Adaptation Time
- Provides Longer Range, Including 2x Range Over Other BLE-Only Solutions
Advanced Power Management for Extended Battery Life and Ease of Design:
- On-Chip Power Management, Including Direct Connection to Battery
- Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
- Shutdown and Sleep Modes to Minimize Power Consumption
Physical Interfaces:
- UART Transport Layer with Maximum Rate of 4 Mbps
- Three-Wire UART Transport Layer with Maximum Rate of 4 Mbps
- Fully Programmable Digital PCM-I2S Codec Interface
CC256x Bluetooth Hardware Evaluation Tool: PC-Based Application to Evaluate RF Performance of the Device and Configure Service Pack
Lead-Free Design Compliant with RoHS Requirements
Built-In CC2564B Single-Chip Bluetooth Device Fully Compliant with Bluetooth and EDR
Supports Class 1.5 (High-Output Power) Applications
Small Size with Low Power Consumption
Supports Maximum Bluetooth Data Rates Over HCI UART Interface
Supports Multiple Bluetooth Profiles with Enhanced QoS (Mono and Stereo) Assisted A2DP (No Host Processing Required)

1.2 Applications

Mobile Accessories
Sports and Fitness Applications
Wireless Audio Solutions
Remote Controls
Toys

1.3 Description

The CC2564MODN TI Bluetooth HCI module is a complete Bluetooth BR/EDR/LE HCI solution that reduces design effort and enables fast time to market. Based on TI’s seventh-generation Bluetooth core, the HCI module provides a product-proven solution that is Bluetooth 4.1 compliant. When coupled with a microcontroller unit (MCU), the HCI module provides best-in-class RF performance.

TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation.

With transmit power and receive sensitivity, this solution provides a best-in-class range of about 2x, compared to other BLE-only solutions. A royalty-free software Bluetooth stack available from TI is pre-integrated with TI's MSP430 and ARM Cortex-M3 and Cortex-M4 MCUs. The stack is also available for made for iPod® (MFi) solutions and on other MCUs through TI's partners. Some of the profiles supported today include: serial port profile (SPP), advanced audio distribution profile (A2DP), human interface device (HID), and several BLE profiles (these profiles vary based on the supported MCU).

In addition to software, this solution consists of a reference design with a low BOM cost. For more information on TI’s wireless platform solutions for Bluetooth, see TI's CC256x wiki.

产品器件信息

PART NUMBER	PACKAGE	BODY SIZE
CC2564MODNCMOET	MOE (33)	7.1 mm x 7.1 mm
CC2564MODNCMOER	MOE (33)	7.1 mm x 7.1 mm

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