LP2998 - DDR-I、DDR-II 和 DDR-III 终端稳压器

LP2998是TI德州仪器公司的一款无产品，LP2998是DDR-I、DDR-II 和 DDR-III 终端稳压器，本站介绍了LP2998的封装应用图解、特点和优点、功能等，并给出了与LP2998相关的TI元器件型号供参考。

LP2998 - DDR-I、DDR-II 和 DDR-III 终端稳压器 - 无 - DDR存储器电源终端 - 德州仪器

产品特性

AEC-Q100 Test Guidance with the following results (SO PowerPAD-8):
- Device HBM ESD Classification Level H1C
- Junction Temperature Range –40°C to 125°C
1.35 V Minimum VDDQ
Source and Sink Current
Low Output Voltage Offset
No External Resistors Required
Linear Topology
Suspend to Ram (STR) Functionality
Low External Component Count
Thermal Shutdown

产品应用

DDR1, DDR2, DDR3, and DDR3L Termination Voltage
Automotive Infotainment
FPGA
Industrial/Medical PC
SSTL-18, SSTL-2, and SSTL-3 Termination
HSTL Termination

产品说明

The LP2998 linear regulator is designed to meet JEDEC SSTL-2 and JEDEC SSTL-18 specifications for termination of DDR-SDRAM and DDR2 memory. The device also supports DDR3 and DDR3L VTT bus termination with VDDQ min of 1.35 V. The device contains a high-speed operational amplifier to provide excellent response to load transients. The output stage prevents shoot through while delivering 1.5 A continuous current and transient peaks up to 3 A in the application as required for DDR-SDRAM termination. The LP2998 also incorporates a VSENSE pin to provide superior load regulation and a VREF output as a reference for the chipset and DIMMs.

An additional feature found on the LP2998 is an active low shutdown (SD) pin that provides Suspend To RAM (STR) functionality. When SD is pulled low the VTT output will tri-state providing a high impedance output, but, VREF will remain active. A power savings advantage can be obtained in this mode through lower quiescent current.

产品器件信息

PART NUMBER	PACKAGE	BODY SIZE (NOM)
LP2998	SO PowerPAD™ (8)	4.89 mm x 3.90 mm
LP2998	SOIC (8)	4.90 mm x 3.91 mm
LP2998-Q1	SO PowerPAD™ (8)	4.89 mm x 3.90 mm

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