SMJ320C6701-SP - 抗辐射 V 类浮点数字信号处理器

SMJ320C6701-SP是TI德州仪器公司的一款C6000DSP产品，SMJ320C6701-SP是抗辐射 V 类浮点数字信号处理器，本站介绍了SMJ320C6701-SP的封装应用图解、特点和优点、功能等，并给出了与SMJ320C6701-SP相关的TI元器件型号供参考。

SMJ320C6701-SP - 抗辐射 V 类浮点数字信号处理器 - C6000DSP - 数字信号处理器 - 德州仪器

产品描述

The SMJ320C67x DSPs are the floating-point DSP family in the SMJ320C6000 platform. The SMJ320C6701 (’C6701) device is based on the high-performance, advanced VelociTI very-long-instruction-word (VLIW) architecture developed by Texas Instruments (TI), making this DSP an excellent choice for multichannel and multifunction applications. With performance of up to 1 giga floating-point operations per second (GFLOPS) at a clock rate of 140 MHz, the ’C6701 offers cost-effective solutions to high-performance DSP programming challenges. The ’C6701 DSP possesses the operational flexibility of high-speed controllers and the numerical capability of array processors. This processor has 32 general-purpose registers of 32-bit word length and eight highly independent functional units. The eight functional units provide four floating-/fixed-point ALUs, two fixed-point ALUs, and two floating-/fixed-point multipliers. The ’C6701 can produce two multiply-accumulates (MACs) per cycle for a total of 334 million MACs per second (MMACS). The ’C6701 DSP also has application-specific hardware logic, on-chip memory, and additional on-chip peripherals.

The ’C6701 includes a large bank of on-chip memory and has a powerful and diverse set of peripherals. Program memory consists of a 64K-byte block that is user-configurable as cache or memory-mapped program space. Data memory consists of two 32K-byte blocks of RAM. The peripheral set includes two multichannel buffered serial ports (McBSPs), two general-purpose timers, a host-port interface (HPI), and a glueless external memory interface (EMIF) capable of interfacing to SDRAM or SBSRAM and asynchronous peripherals.

The ’C6701 has a complete set of development tools that includes a new C compiler, an assembly optimizer to simplify programming and scheduling, and a Windows debugger interface for visibility into source code execution.

产品特性

Rad-Tolerant: 100-kRad (Si) TID
SEL Immune at 89MeV-cm2/mg LET Ions
QML-V Qualified, SMD 5962-98661
Highest-Performance Floating-Point Digital Signal Processor (DSP) SMJ320C6701
- 7-ns Instruction Cycle Time
- 140-MHz Clock Rate
- Eight 32-Bit Instructions/Cycle
- Up to One GFLOPS Performance
- Pin Compatible With ’C6201 Fixed-Point DSP
SMJ: QML Processing to MIL-PRF-38535
SM: Standard Processing
Operating Temperature Ranges
- –55°C to 115°C
- –55°C to 125°C
VelociTI Advanced Very Long Instruction Word (VLIW) ’C67x CPU Core
- Eight Highly Independent Functional Units:
  - Four ALUs (Floating and Fixed Point)
  - Two ALUs (Fixed Point)
  - Two Multipliers (Floating and Fixed Point)
- Load-Store Architecture With 32 32-Bit General-Purpose Registers
- Instruction Packing Reduces Code Size
- All Instructions Conditional
Instruction Set Features
- Hardware Support for IEEE Single-Precision Instructions
- Hardware Support for IEEE Double-Precision Instructions
- Byte Addressable (8-/16-/32-Bit Data)
- 32-Bit Address Range
- 8-Bit Overflow Protection
- Saturation
- Bit-Field Extract, Set, Clear
- Bit Counting
- Normalization
1M-Bit On-Chip SRAM
- 512K-Bit Internal Program/Cache (16K 32-Bit Instructions)
- 512K-Bit Dual-Access Internal Data (64K Bytes)
32-Bit External Memory Interface (EMIF)
- Glueless Interface to Synchronous Memories: SDRAM and SBSRAM
- Glueless Interface to Asynchronous Memories: SRAM and EPROM
Four-Channel Bootloading Direct Memory Access (DMA) Controller With Auxiliary Channel
16-Bit Host-Port Interface (HPI)
- Access to Entire Memory Map
Two Multichannel Buffered Serial Ports (McBSPs)
- Direct Interface to T1/E1, MVIP, SCSA Framers
- ST Bus Switching Compatible
- Up to 256 Channels Each
- AC97 Compatible
- Serial Peripheral Interface (SPI) Compatible (Motorola)
Two 32-Bit General-Purpose Timers
Flexible Phase-Locked Loop (PLL) Clock Generator
IEEE Std 1149.1 (JTAG(1)) Boundary Scan Compatible
429-Pin Ceramic Ball Grid Array (CBGA/GLP) and Ceramic Land Grid Array (CLGA/ZMB) Package Types
0.18-µm/5-Level Metal Process
- CMOS Technology
3.3-V I/Os, 1.9 V Internal
Engineering Evaluation (/EM) Samples are Available(2)

(1) IEEE Std 1149.1-1990 Test Access Port and Boundary Scan Architecture (2) These units are intended for engineering evaluation only. They are processed to a non-compliant flow (e.g. No Burn-In, etc.) and are tested to a temperature rating of 25°C only. These units are not suitable for qualification, production, radiation testing or flight use. Parts are not warranted for performance over the full MIL specified temperature range of –55°C to 125°C or operating life.

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