

- SN74HCS237DR - 集成电路(IC) > 逻辑 > 信号开关,多路复用器,解码器
- RC4558PG4 - 集成电路(IC) > 线性 > 放大器 > 仪器,运算放大器,缓冲器
- TDA4APE4T5AANDRQ1 - 集成电路(IC) > 嵌入式 > 微处理器
- SN74LVC541AQDWRQ1 - 集成电路(IC) > 逻辑 > 缓冲器,驱动器,接收器,收发器
- CSD17522Q5A - 分立半导体产品 > 晶体管 > FET,MOSFET > 单 FET,MOSFET
- VSP2560PTG4 - 集成电路(IC) > 数据采集 > 模拟前端(AFE)
- TLC393CPWR - 集成电路(IC) > 线性 > 比较器
- LP3928TLX-1828/NOPB - 集成电路(IC) > 逻辑 > 转换器,电平移位器
- TAS5602DCA - 集成电路(IC) > 线性 > 放大器 > 音频放大器
- SN74LVC1G86DCKR - 集成电路(IC) > 逻辑 > 门和反相器
- PCI4510AGHK - 集成电路(IC) > 专用 IC
- TL072CPE4 - 集成电路(IC) > 线性 > 放大器 > 仪器,运算放大器,缓冲器
- SN751177NSRE4 - 集成电路(IC) > 接口 > 驱动器,接收器,收发器
- LM2576T-ADJ/LB03 - 集成电路(IC) > 电源管理(PMIC) > 稳压器 - DC-DC 开关稳压器
- TPS70175QPWPRQ1 - 集成电路(IC) > 电源管理(PMIC) > 稳压器 - 线性
- DS92LV16TVHGX - 集成电路(IC) > 接口 > 串行器,解串器
- DRV2604LDGSR - 集成电路(IC) > 电源管理(PMIC) > 电机驱动器,控制器
- UCC29411PW - 集成电路(IC) > 电源管理(PMIC) > 稳压器 - DC-DC 开关稳压器
- TPS61182RTER - 集成电路(IC) > 电源管理(PMIC) > LED 驱动器
- TL4050B25IDBZR - 集成电路(IC) > 电源管理(PMIC) > 电压基准



SN74ALVTH16601 - 具有三态输出的 2.5V/3.3V 18 位通用总线收发器
SN74ALVTH16601是TI德州仪器公司的一款通用总线收发器(UBT)产品,SN74ALVTH16601是具有三态输出的 2.5V/3.3V 18 位通用总线收发器,本站介绍了SN74ALVTH16601的封装应用图解、特点和优点、功能等,并给出了与SN74ALVTH16601相关的TI元器件型号供参考。
SN74ALVTH16601 - 具有三态输出的 2.5V/3.3V 18 位通用总线收发器 - 通用总线收发器(UBT) - 通用总线功能 - 德州仪器
The 'ALVTH16601 devices are 18-bit universal bus transceivers designed for 2.5-V or 3.3-V VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.
The devices combine D-type latches and D-type flip-flops to allow data flow in transparent, latched, and clocked modes.
Data flow in each direction is controlled by output-enable (OEAB\ and OEBA\), latch-enable (LEAB and LEBA), and clock (CLKAB and CLKBA) inputs. The clock can be controlled by the clock-enable (CLKENAB\ and CLKENBA\) inputs. For A-to-B data flow, the device operates in the transparent mode when LEAB is high. When LEAB is low, the A data is latched if CLKAB is held at a high or low logic level. If LEAB is low, the A data is stored in the latch/flip-flop on the low-to-high transition of CLKAB. Output enable OEAB\ is active low. When OEAB\ is low, the outputs are active. When OEAB\ is high, the outputs are in the high-impedance state.
Data flow for B to A is similar to that of A to B, but uses OEBA\, LEBA, CLKBA, and CLKENBA\.
This device is fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.
When VCC is between 0 and 1.2 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.2 V, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.
The SN54ALVTH16601 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ALVTH16601 is characterized for operation from -40°C to 85°C.
- UBTTM (Universal Bus Transceiver) Combines D-Type Latches and D-Type Flip-Flops for Operation in Transparent, Latched, Clocked, or Clock-Enabled Mode
- State-of-the-Art Advanced BiCMOS Technology (ABT) WidebusTM Design for 2.5-V and 3.3-V Operation and Low Static-Power Dissipation
- Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 2.3-V to 3.6-V VCC)
- Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C
- High-Drive (-24/24 mA at 2.5-V and -32/64 mA at 3.3-V VCC)
- Ioff and Power-Up 3-State Support Hot Insertion
- Use Bus Hold on Data Inputs in Place of External Pullup/Pulldown Resistors to Prevent the Bus From Floating
- Auto3-State Eliminates Bus Current Loading When Output Exceeds VCC + 0.5 V
- Flow-Through Architecture Facilitates Printed Circuit Board Layout
- Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
- ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), Thin Very Small-Outline (DGV) Packages, and 380-mil Fine-Pitch Ceramic Flat (WD) Package
NOTE: For tape and reel order entry: The DGGR package is abbreviated to GR and the DGVR package is abbreviated to VR. UBT and Widebus are trademarks of Texas Instruments Incorporated.
- SN74AUP1G57 - 低功耗可配置多功能门
- SN54LS273 - 具有清零功能的八路 D 类触发器
- LT1009M - 2.5V 集成参考电路
- DAC161P997 - 用于 4-20mA 环路的单线 16 位 DAC
- TPS65301-Q1 - 汽车 3MHz 降压稳压器、三路线性稳压器、和受保护传感器电源
- SN74ALS804A - 六路 2 输入与非驱动器
- TPS24700 - 2.5V 至 18V 高效热插拔控制器
- LM96194 - 具有 PI 风扇控制的 TruTherm 硬件监控器,用于工作站管理
- SN74ALS166 - 并联负载 8 位串行移位寄存器
- SN74LVC3GU04 - 三路反向器闸



