SN74AUP1G99 - 具有三态输出的低功耗超级可配置多功能门

SN74AUP1G99是TI德州仪器公司的一款无产品，SN74AUP1G99是具有三态输出的低功耗超级可配置多功能门，本站介绍了SN74AUP1G99的封装应用图解、特点和优点、功能等，并给出了与SN74AUP1G99相关的TI元器件型号供参考。

SN74AUP1G99 - 具有三态输出的低功耗超级可配置多功能门 - 无 - 小尺寸逻辑器件 - 德州仪器

产品描述

产品特性

Available in the Texas Instruments NanoFree™ Package
Low Static-Power Consumption (ICC = 0.9 µA Max)
Low Dynamic-Power Consumption (Cpd = 5 pF Typ at 3.3 V)
Low Input Capacitance (CI = 1.5 pF)
Low Noise – Overshoot and Undershoot <10% of VCC
Input-Disable Feature Allows Floating Input Conditions
Ioff Supports Partial-Power-Down Mode Operation
Includes Schmitt-Trigger Inputs
Wide Operating VCC Range of 0.8 V to 3.6 V
Optimized for 3.3-V Operation
3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
tpd = 7.4 ns Max at 3.3 V
Suitable for Point-to-Point Applications
Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model (A114-B, Class II)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)

NanoFree Is a trademark of Texas Instruments.

DESCRIPTION/ORDERING INFORMATION

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (see Figures 1 and 2).

The SN74AUP1G99 features configurable multiple functions with a 3-state output. This device has the input-disable feature, which allows floating input signals. The inputs and output are disabled when the output-enable (OE) input is high. When OE is low, the output state is determined by 16 patterns of 4-bit input. The user can choose the logic functions, such as MUX, AND, OR, NAND, NOR, XOR, XNOR, inverter, and buffer. All inputs can be connected to VCC or GND.

This device functions as an independent gate with Schmitt-trigger inputs, which allows for slow input transition and better switching noise immunity at the input.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

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