SN74AUP3G06是TI公司的一款无产品，SN74AUP3G06是具有漏极开路的低功耗三路反向缓冲器/驱动器，本页介绍了SN74AUP3G06的产品说明、应用、特性等，并给出了与SN74AUP3G06相关的TI元器件型号供参考。
SN74AUP3G06 - 具有漏极开路的低功耗三路反向缓冲器/驱动器 - 无 - 小尺寸逻辑器件 - TI公司（Texas Instruments，德州仪器）
- Available in the Texas Instruments NanoStar™ Package
- Low Static-Power Consumption (ICC = 0.9 µA Maximum)
- Low Dynamic-Power Consumption (Cpd = 4.3 pF Typ at 3.3 V)
- Low Input Capacitance (Ci = 1.5 pF Typical)
- Low Noise – Overshoot and Undershoot <10% of VCC
- Ioff Supports Partial-Power-Down Mode Operation
- Wide Operating VCC Range of 0.8 V to 3.6 V
- Optimized for 3.3-V Operation
- 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
- tpd = 4.3 ns Maximum at 3.3 V
- Suitable for Point-to-Point Applications
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model (A114-B, Class II)
- 1000-V Charged-Device Model (C101)
NanoStar is a trademark of Texas Instruments
DESCRIPTION/ORDERING INFORMATION
The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).
The output of SN74AUP3G06 is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
