SN74LVC1G175是TI公司的一款无产品，SN74LVC1G175是具有异步清零功能的单路 D 类触发器，本页介绍了SN74LVC1G175的产品说明、应用、特性等，并给出了与SN74LVC1G175相关的TI元器件型号供参考。
SN74LVC1G175 - 具有异步清零功能的单路 D 类触发器 - 无 - 小尺寸逻辑器件 - TI公司（Texas Instruments，德州仪器）
- Available in the Texas Instruments NanoFree™ Package
- Supports 5-V VCC Operation
- Inputs Accept Voltages to 5.5 V
- Supports Down Translation to VCC
- Max tpd of 4.3 ns at 3.3 V
- Low Power Consumption, 10-µA Max ICC
- ±24-mA Output Drive at 3.3 V
- Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
- TV/Set Top Box/Audio
- EPOS (Electronic Point-of-Sale)
- Motor Drives
- PC/Notebook
- Servers
- Factory Automation and Control
- Tablets
- Medical Healthcare and Fitness
- Smart Grid
- Telecom Infrastructure
- Enterprise Switching
- Projectors
- Storage
This single D-type flip-flop is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC1G175 device has an asynchronous clear (CLR) input. When CLR is high, data from the input pin (D) is transferred to the output pin (Q) on the clock's (CLK) rising edge. When CLR is low, Q is forced into the low state, regardless of the clock edge or data on D.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
| PART NUMBER | PACKAGE | BODY SIZE (NOM) |
|---|---|---|
| SN74LVC1G175DBV | SOT-23 (6) | 2.90 mm × 1.60 mm |
| SN74LVC1G175DCK | SC70 (6) | 2.00 mm × 1.25 mm |
| SN74LVC1G175DRY | SON (6) | 1.45 mm × 1.00 mm |
| SN74LVC1G175YZP | DSBGA (6) | 1.41 mm × 0.91 mm |
