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SN74LVC2G06 - 产品图解:
SN74LVC2G06-具有漏极开路输出的双路反向器缓冲器/驱动器
SN74LVC2G06-TI芯片-小尺寸逻辑器件-逻辑
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TI产品 - SN74LVC2G06介绍
SN74LVC2G06 - 具有漏极开路输出的双路反向器缓冲器/驱动器

SN74LVC2G06是TI公司的一款TI芯片产品,SN74LVC2G06是具有漏极开路输出的双路反向器缓冲器/驱动器,本页介绍了SN74LVC2G06的产品说明、应用、特性等,并给出了与SN74LVC2G06相关的TI元器件型号供参考。

SN74LVC2G06 - 具有漏极开路输出的双路反向器缓冲器/驱动器 - TI芯片 - 小尺寸逻辑器件 - TI公司(Texas Instruments,德州仪器)

产品特性
  • Available in the Texas Instruments Package
  • Supports 5-V VCC Operation
  • Max tpd of 3.4 ns at 3.3 V
  • Low Power Consumption, 10-μA Max ICC
  • ±24-mA Output Drive at 3.3 V
  • Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25°C
  • Inputs and Open-Drain Outputs Accept Voltages up to 5.5 V
  • Ioff Supports Live Insertion, Partial-Power-Down Mode and Back-Drive Protection
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • Supports Down-Translation (5 V to 3.3 V and 3.3 V to 1.8 V)
  • ESD Protection Exceeds JESD 22
    • 2000-V Human Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
产品应用
  • AV Receivers
  • Blu-ray Players and Home Theaters
  • DVD Recorders and Players
  • Desktop or Notebook PCs
  • Digital Radio or Internet Radio Players
  • Digital Video Cameras (DVC)
  • Embedded PC
  • GPS: Personal Navigation Devices
  • Mobile Internet Devices
  • Network Projector Front-End
  • Portable Media Players
  • Pro Audio Mixers
  • Smoke Detectors
  • Solid-State Drive (SSD): Enterprise
  • High-Definition (HDTV)
产品说明

This dual inverter buffer and driver is designed for 1.65-V to 5.5-V VCC operation.

The output of the SN74LVC2G06 device is an open-drain which can be connected to other open-drain outputs to implement active-low, wired-OR, or active-high wired-AND functions. The maximum sink current is 32 mA.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

产品器件信息
ORDER NUMBERPACKAGE BODY SIZE (NOM)
SN74LVC2G06DBVSOT-23 (6)2.90 mm × 1.60 mm
SN74LVC2G06DCKSC70 (6)2.00 mm × 1.25 mm
SN74LVC2G06DRYSON (6)1.45 mm × 1.00 mm
SN74LVC2G06DSFSON (6)1.00 mm × 1.00 mm
SN74LVC2G06YZPDSBGA (6)1.41 mm × 0.91 mm
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