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TLV5614IYZ - 2.7V to 5.5V, 12-Bit Quad DAC in Wafer Chip Scale Package
TLV5614IYZ是TI德州仪器公司的一款精密DAC(=<10MSPS)产品,TLV5614IYZ是2.7V to 5.5V, 12-Bit Quad DAC in Wafer Chip Scale Package,本站介绍了TLV5614IYZ的封装应用图解、特点和优点、功能等,并给出了与TLV5614IYZ相关的TI元器件型号供参考。
TLV5614IYZ - 2.7V to 5.5V, 12-Bit Quad DAC in Wafer Chip Scale Package - 精密DAC(=<10MSPS) - 数模转换器 - 德州仪器
The TLV5614IYZ is a quadruple, 12-bit, voltage output digital-to-analog converter (DAC) with a flexible 4-wire serial interface. The serial interface allows glueless interface to TMS320, SPI, QSPI, and Microwire serial ports. The TLV5614IYZ is programmed with a 16-bit serial word comprised of a DAC address, individual DAC control bits, and a 12-bit DAC value. The device has provision for two supplies: one digital supply for the serial interface (via pins DVDD and DGND), and one for the DACs, reference buffers, and output buffers (via pins AVDD and AGND). Each supply is independent of the other, and can be any value between 2.7V and 5.5V. The dual supplies allow a typical application where the DAC is controlled via a microprocessor operating on a 3V supply (also used on pins DVDD and DGND) with the DACs operating on a 5V supply. Of course, the digital and analog supplies can also be tied together.
The resistor string output voltage is buffered by a 2x gain rail-to-rail output buffer. The buffer features a Class-AB output stage to improve stability and reduce settling time. A rail-to-rail output stage and a power-down mode makes it ideal for single voltage, battery-based applications. The DAC settling time is programmable, allowing the designer to optimize speed versus power dissipation. Settling time is chosen by the control bits within the 16-bit serial input string. A high-impedance buffer is integrated on the REFINAB and REFINCD terminals to reduce the need for a low source impedance drive to the terminal. REFINAB and REFINCD allow DACs A and B to have a different reference voltage than DACs C and D.
The TLV5614IYZ is built with a CMOS process and is available in a 16-terminal bumped die (wafer chip scale) package. It is characterized for operation from -40°C to +85°C in a wire-bonded, small outline (SOIC) package.
- Four 12-Bit D/A Converters
- Programmable Settling Time of Either 3µs or9µs Typ
- TMS320 DSP Family, (Q)SPI, and Microwire Compatible Serial Interface
- Internal Power-On Reset
- Low Power Consumption:
- 8mW, Slow Mode; 5V Supply
- 3.6mW, Slow Mode; 3V Supply
- Reference Input Buffer
- Voltage Output Range . . . 2x Reference Input Voltage
- Monotonic Over Temperature
- Dual 2.7V to 5.5V Supply (Separate Digital and Analog Supplies)
- Hardware Power-Down (10nA)
- Software Power-Down (10nA)
- Simultaneous Update
- APPLICATIONS
- Battery-Powered Test Instruments
- Digital Offset and Gain Adjustment
- Industrial Process Controls
- Machine and Motion Control Devices
- Communications
- Arbitrary Waveform Generation
TMS320 is a trademark of Texas Instruments, Inc. SPI is a trademark of Motorola, Inc. Microwire is a trademark of National Semiconductor Corporation. MCS is a registered trademark of National Semiconductor Corporation. All other trademarks are the property of their respective owners.
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