TMP275 - 具有 I2C/SMBus 接口的 ±0.5°C 温度传感器，采用工业标准 LM75 尺寸和引脚

TMP275是TI德州仪器公司的一款本地温度传感器产品，TMP275是具有 I2C/SMBus 接口的 ±0.5°C 温度传感器，采用工业标准 LM75 尺寸和引脚，本站介绍了TMP275的封装应用图解、特点和优点、功能等，并给出了与TMP275相关的TI元器件型号供参考。

TMP275 - 具有 I2C/SMBus 接口的 ±0.5°C 温度传感器，采用工业标准 LM75 尺寸和引脚 - 本地温度传感器 - 温度传感器和控制IC - 德州仪器

产品特性

High Accuracy:
- ±0.5°C (Maximum) from −20°C to 100°C
- ±1°C (Maximum) from −40°C to 125°C
Low Quiescent Current:
- 50 μA (Typical)
- 0.1-μA Standby
Resolution: 9- to 12-Bits, User-Selectable
Digital Output: SMBus™, Two-Wire, and I2C Interface Compatibility
8 I2C/SMBus Addresses
Wide Supply Range: 2.7 V to 5.5 V
Small VSSOP-8 and SOIC-8 Packages
No Specified Power-up Sequence Required; Two-Wire Bus Pullups May Be Enabled Before V+

产品应用

Power-Supply Temperature Monitoring
Computer Peripheral Thermal Protection
Battery Management
Office Machines
Servers
Thermostat Controls
Environmental Monitoring and HVAC
Electromechanical Device Temperature
Data Logger

产品说明

The TMP275 is a ±0.5°C accurate integrated digital temperature sensor with a 12-bit analog-to-digital converter (ADC) that can operate as low as 2.7-V supply voltage and is pin and register compatible with the Texas Instruments LM75, TMP75, TMP75B, and TMP175 devices. This device is available in SOIC-8 and VSSOP-8 packages, and it requires no external components to sense the temperature. The TMP275 is capable of reading temperatures with a maximum resolution of 0.0625°C (12 bits) and as low as 0.5°C (9 bits), which allows the user to maximize efficiency by programming for higher resolution or faster conversion time. The device is specified over a temperature range of -40°C to 125°C.

The TMP275 device features SMBus and two-wire interface compatibility, and allows up to eight devices on the same bus with the SMBus overtemperature alert function. The factory-calibrated temperature accuracy and the noise-immune digital interface make the TMP275 the preferred solution for temperature compensation of other sensors and electronic components, without the need for additional system-level calibration or elaborate board layout for distributed temperature sensing.

产品器件信息

PART NUMBER	PACKAGE	BODY SIZE (NOM)
TMP275	SOIC (8)	4.90 mm × 3.91 mm
TMP275	VSSOP (8)	3.00 mm × 3.00 mm

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