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TMP275 - 具有 I2C/SMBus 接口的 ±0.5°C 温度传感器,采用工业标准 LM75 尺寸和引脚
TMP275是TI德州仪器公司的一款本地温度传感器产品,TMP275是具有 I2C/SMBus 接口的 ±0.5°C 温度传感器,采用工业标准 LM75 尺寸和引脚,本站介绍了TMP275的封装应用图解、特点和优点、功能等,并给出了与TMP275相关的TI元器件型号供参考。
TMP275 - 具有 I2C/SMBus 接口的 ±0.5°C 温度传感器,采用工业标准 LM75 尺寸和引脚 - 本地温度传感器 - 温度传感器和控制IC - 德州仪器
- High Accuracy:
- ±0.5°C (Maximum) from −20°C to 100°C
- ±1°C (Maximum) from −40°C to 125°C
- Low Quiescent Current:
- 50 μA (Typical)
- 0.1-μA Standby
- Resolution: 9- to 12-Bits, User-Selectable
- Digital Output: SMBus™, Two-Wire, and I2C Interface Compatibility
- 8 I2C/SMBus Addresses
- Wide Supply Range: 2.7 V to 5.5 V
- Small VSSOP-8 and SOIC-8 Packages
- No Specified Power-up Sequence Required; Two-Wire Bus Pullups May Be Enabled Before V+
- Power-Supply Temperature Monitoring
- Computer Peripheral Thermal Protection
- Battery Management
- Office Machines
- Servers
- Thermostat Controls
- Environmental Monitoring and HVAC
- Electromechanical Device Temperature
- Data Logger
The TMP275 is a ±0.5°C accurate integrated digital temperature sensor with a 12-bit analog-to-digital converter (ADC) that can operate as low as 2.7-V supply voltage and is pin and register compatible with the Texas Instruments LM75, TMP75, TMP75B, and TMP175 devices. This device is available in SOIC-8 and VSSOP-8 packages, and it requires no external components to sense the temperature. The TMP275 is capable of reading temperatures with a maximum resolution of 0.0625°C (12 bits) and as low as 0.5°C (9 bits), which allows the user to maximize efficiency by programming for higher resolution or faster conversion time. The device is specified over a temperature range of -40°C to 125°C.
The TMP275 device features SMBus and two-wire interface compatibility, and allows up to eight devices on the same bus with the SMBus overtemperature alert function. The factory-calibrated temperature accuracy and the noise-immune digital interface make the TMP275 the preferred solution for temperature compensation of other sensors and electronic components, without the need for additional system-level calibration or elaborate board layout for distributed temperature sensing.
| PART NUMBER | PACKAGE | BODY SIZE (NOM) |
|---|---|---|
| TMP275 | SOIC (8) | 4.90 mm × 3.91 mm |
| VSSOP (8) | 3.00 mm × 3.00 mm |
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