TPA701 - 700mW 低电压音频功率放大器

TPA701是TI德州仪器公司的一款扬声器放大器（AB类/D类）产品，TPA701是700mW 低电压音频功率放大器，本站介绍了TPA701的封装应用图解、特点和优点、功能等，并给出了与TPA701相关的TI元器件型号供参考。

TPA701 - 700mW 低电压音频功率放大器 - 扬声器放大器（AB类/D类） - 低功耗放大器 - 德州仪器

产品描述

The TPA701 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA701 can deliver 250-mW of continuous power into a BTL 8- load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown. The TPA701 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.

产品特性

Fully Specified for 3.3-V and 5-V Operation
Wide Power Supply Compatibility 2.5 V – 5.5 V
Output Power for RL = 8
- 700 mW at VDD = 5 V, BTL
- 250 mW at VDD = 3.3 V, BTL
Ultralow Quiescent Current in Shutdown Mode . . . 1.5 nA
Thermal and Short-Circuit Protection
Surface-Mount Packaging
- SOIC
- PowerPAD™ MSOP

PowerPAD is a trademark of Texas Instruments.

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