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TPS81256 - 产品图解:
TPS81256-集成电源解决方案,采用 MicroSiPT 封装的 3W 高效升压转换器
TPS81256-非隔离式模块-电源模块-电源管理
TPS81256-3W,高效升压转换器,此转换器采用MicroSiP? 封装
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TI产品 - TPS81256介绍

TPS81256 - 集成电源解决方案,采用 MicroSiPT 封装的 3W 高效升压转换器

TPS81256是TI德州仪器公司的一款非隔离式模块产品,TPS81256是集成电源解决方案,采用 MicroSiPT 封装的 3W 高效升压转换器,本站介绍了TPS81256的封装应用图解、特点和优点、功能等,并给出了与TPS81256相关的TI元器件型号供参考。

TPS81256 - 集成电源解决方案,采用 MicroSiPT 封装的 3W 高效升压转换器 - 非隔离式模块 - 电源模块 - 德州仪器

产品特性
  • 91% Efficiency at 4MHz Operation
  • Wide VIN Range From 2.5V to 5.5V
  • IOUT ≥550mA at VOUT = 5.0V, VIN ≥3.3V
  • Fixed Output Voltage 5.0V
  • ±2% Total DC Voltage Accuracy
  • 43µA Supply Current
  • Best-in-Class Line and Load Transient
  • VIN ≥ VOUT Operation
  • Low-Ripple Light-Load PFM Mode
  • True Load Disconnect During Shutdown
  • Thermal Shutdown and Overload Protection
  • Sub 1-mm Profile Solution
  • Total Solution Size <9mm2
  • 9-Pin MicroSiP Packaging
产品应用
  • Cell Phones, Smart-Phones, Tablet PCs
  • Mono and Stereo APA Applications
  • USB-OTG, HDMI Applications
  • USB Charging Port (5V)
产品说明

The TPS81256 device is a complete MicroSiP DC/DC step-up power solution intended for battery-powered portable applications. Included in the package are the switching regulator, inductor and input/output capacitors. Only a tiny additional output capacitor is required to finish the design.

The TPS81256 is based on a high-frequency synchronous step-up DC/DC converter optimized for battery-powered portable applications.

The DC/DC converter operates at a regulated 4-MHz switching frequency and enters power-save mode operation at light load currents to maintain high efficiency over the entire load current range.

The PFM mode extends the battery life by reducing the supply current to 43μA (typical) during light load operation. Intended for low-power applications, the TPS81256 supports more than 3W output power over a full Li-Ion battery voltage range. Input current in shutdown mode is less than 1µA (typical), which maximizes battery life.

The TPS81256 offers a very small solution size of less than 9mm2 due to minimum amount of external components. The solution is packaged in a compact (2.6mm x 2.9mm) and low profile (1.0mm) BGA package suitable for automated assembly by standard surface mount equipment.

产品器件信息
PART NUMBERPACKAGEBODY SIZE (NOM)
TPS81256µSIP (9)2.925 mm × 2.575 mm
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