TXS0206-29 - 具有 ESD 保护、EMI 滤波和 2.9V LDO 的 MMC、SD 卡、MemoryStick 电压转换

TXS0206-29是TI德州仪器公司的一款应用特定电压转换产品，TXS0206-29是具有 ESD 保护、EMI 滤波和 2.9V LDO 的 MMC、SD 卡、MemoryStick 电压转换，本站介绍了TXS0206-29的封装应用图解、特点和优点、功能等，并给出了与TXS0206-29相关的TI元器件型号供参考。

TXS0206-29 - 具有 ESD 保护、EMI 滤波和 2.9V LDO 的 MMC、SD 卡、MemoryStick 电压转换 - 应用特定电压转换 - 电压电平转换 - 德州仪器

产品描述

产品特性

Level Translator
- VCCA Range of 1.1 V to 3.6 V
- Fast Propagation Delay (4 ns Max When Translating Between 1.8 V and 2.9 V)
Low-Dropout (LDO) Regulator
- 200-mA LDO Regulator With Enable
- 2.9-V Output Voltage
- 3.05-V to 5.5-V Input Voltage Range
- Very Low Dropout: 200 mV at 200 mA
ESD Protection Exceeds JESD 22 (A Port)
- 2000-V Human-Body Model (A114-B)
- 1000-V Charged-Device Model (C101)
±8-kV Contact Discharge IEC 61000-4-2 ESD (BPort)

All other trademarks are the property of their respective owners.

DESCRIPTION/ORDERING INFORMATION

The TXS0206-29 is a complete solution for interfacing microprocessors with MultiMediaCards (MMCs), secure digital (SD) cards, and Memory Stick™ cards. It is comprised of a high-speed level translator, a low-dropout (LDO) voltage regulator, IEC level ESD protection, and EMI filtering circuitry.

The voltage-level translator has two supply voltage pins. VCCA can be operated over the full range of 1.1 V to 3.6V. VCCB is set at 2.9 V and is supplied by an internal LDO. The integrated LDO accepts input voltages from 3.05 V to as high as 5.5 V and outputs 2.9 V, 200 mA to the B-side circuitry and to the external memory card. The TXS0206-29 enables system designers to easily interface low-voltage microprocessors to memory cards operating at 2.9 V.

Memory card standards recommend high-ESD protection for devices that connect directly to the external memory card. To meet this need, the TXS0206-29 incorporates ±8-kV Contact Discharge protection on the card side.

Since memory cards are widely used in mobile phones, PDAs, digital cameras, personal media players, camcorders, set-top boxes, etc. Low static power consumption and small package size make the TXS0206-29 an ideal choice for these applications. The TXS0206-29 is offered in a 20-bump wafer chip scale package (WCSP). This package has dimensions of 1.96mm×1.56mm, with a 0.4-mm ball pitch for effective board-space savings.

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