UCC27423-EP - 具有使能端的增强型产品双路 4A MOSFET 驱动器

UCC27423-EP是TI德州仪器公司的一款低侧驱动器产品，UCC27423-EP是具有使能端的增强型产品双路 4A MOSFET 驱动器，本站介绍了UCC27423-EP的封装应用图解、特点和优点、功能等，并给出了与UCC27423-EP相关的TI元器件型号供参考。

UCC27423-EP - 具有使能端的增强型产品双路 4A MOSFET 驱动器 - 低侧驱动器 - MOSFET和IGBT栅极驱动器 - 德州仪器

产品特性

Industry-Standard Pinout
Enable Functions for Each Driver
High Current-Drive Capability of ±4 A
Unique Bipolar and CMOS True-Drive Output Stage Provides High Current at MOSFET Miller Thresholds
TTL-/CMOS-Compatible Inputs Independent of Supply Voltage
20-ns Typical Rise and 15-ns Typical Fall Times With 1.8-nF Load
Typical Propagation Delay Times of 25 ns With Input Falling and 35 ns With Input Rising
4.5-V to 15-V Supply Voltage
Dual Outputs can be Paralleled for Higher Drive Current
Available in Thermally-Enhanced MSOP PowerPAD™ Package With 4.7°C/W RθJC
Supports Defense, Aerospace, and Medical Applications
- Controlled Baseline
- One Assembly/Test Site
- One Fabrication Site
- Extended Product Life Cycle
- Extended Product-Change Notification
- Product Traceability

产品应用

Switch-Mode Power Supplies
DC/DC Converters
Motor Controllers
Line Drivers
Class-D Switching Amplifiers

产品说明

The UCC27423 and UCC27424 high-speed MOSFET drivers can deliver large peak currents into capacitive loads. Two standard logic options are offered – dual inverting and dual noninverting drivers. The UCC27424 thermally-enhanced 8-pin PowerPAD™ MSOP package (DGN) drastically lowers the thermal resistance to improve long-term reliability. The UCC27423 is offered in a standard SOIC-8 (D) package.

Using a design that inherently minimizes shoot-through current, this driver delivers 4 A of current where it is needed most – at the Miller plateau region during the MOSFET switching transition. A unique bipolar and MOSFET hybrid output stage in parallel also allows efficient current sourcing and sinking at low supply voltages.

The UCC27423 and UCC27424 provide enable (ENB) functions to better control the operation of the driver applications. ENBA and ENBB are implemented on pins 1 and 8, which previously were left unused in the industry-standard pinout. ENBA and ENBB are pulled up internally to VDD for active-high logic and can be left open for standard operation.

产品器件信息

PART NUMBER	PACKAGE	BODY SIZE (NOM)
UCC27423-EP	D (8)	3.91 mm × 4.90 mm
UCC27424-EP	DGN (8)	3.00 mm × 3.00 mm

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