LMV1032 - 用于 3 线模拟驻极体麦克风的放大器

LMV1032是TI德州仪器公司的一款无产品，LMV1032是用于 3 线模拟驻极体麦克风的放大器，本站介绍了LMV1032的封装应用图解、特点和优点、功能等，并给出了与LMV1032相关的TI元器件型号供参考。

LMV1032 - 用于 3 线模拟驻极体麦克风的放大器 - 无 - 麦克风前置放大器 - 德州仪器

产品描述

The LMV1032s are an audio amplifier series for small form factor electret microphones. They are designed to replace the JFET preamp currently being used. The LMV1032 series is ideal for extended battery life applications, such as a Bluetooth communication link. The addition of a third pin to an electret microphones that incorporates an LMV1032 allows for a dramatic reduction in supply current as compared to the JFET equipped electret microphone. Microphone supply current is thus reduced to 60 µA, assuring longer battery life. The LMV1032 series is specified for supply voltages from 1.7V to 5V, and has fixed voltage gains of 6 dB, 15 dB and 25 dB.

The LMV1032 series offers low output impedance over the voice bandwidth, excellent power supply rejection (PSRR), and stability over temperature.

The devices are offered in space saving 4-bump ultra thin DSBGA lead free packages and are thus ideally suited for the form factor of miniature electret microphone packages. These extremely miniature packages have the Large Dome Bump (LDB) technology. This DSBGA technology is designed for microphone PCBs requiring 1 kg adhesion criteria.

产品特性

(Typical LMV1032-15, 1.7V Supply; Unless Otherwise Noted)
Output Voltage Noise (A-weighted) −89 dBV
Low Supply Current 60 μA
Supply Voltage 1.7V to 5V
PSRR 70 dB
Signal to Noise Ratio 61 dB
Input Capacitance 2 pF
Input Impedance >100 M?
Output Impedance <200?
Max Input Signal 170 mVPP
Temperature Range −40°C to 85°C
Large Dome 4-Bump DSBGA Package with Improved Adhesion Technology.

下面可能是您感兴趣的TI德州仪器公司无元器件

TI公司产品现货专家，订购TI公司产品不限最低起订量，TI芯片大陆现货即时发货，香港库存3-5天发货，海外库存7-10天发货

寻找全球TI代理商现货货源 - TI公司（德州仪器）电子元件在线订购