These 18-bit flip-flops feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing wider buffer registers, I/O ports, bidirectional bus drivers with parity, and working registers.

The 'ABT16823 can be used as two 9-bit flip-flops or one 18-bit flip-flop. With the clock-enable () input low, the D-type flip-flops enter data on the low-to-high transitions of the clock. Taking high disables the clock buffer, latching the outputs. Taking the clear () input low causes the Q outputs to go low independently of the clock.

A buffered output-enable () input can be used to place the nine outputs in either a normal logic state (high or low logic level) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without need for interface or pullup components.

does not affect the internal operation of the flip-flops. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

When VCC is between 0 and 2.1 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 2.1 V, should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking/current-sourcing capability of the driver.

The SN54ABT16823 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT16823 is characterized for operation from -40°C to 85°C.

• Members of the Texas Instruments WidebusTM Family
• State-of-the-Art EPIC-IIBTM BiCMOS Design Significantly Reduces Power Dissipation
• High-Impedance State During Power Up and Power Down
• ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
• Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
• Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
• Flow-Through Architecture Optimizes PCB Layout
• High-Drive Outputs (-32-mA IOH, 64-mA IOL)
• Package Options Include Plastic 300-mil Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings

Widebus and EPIC-IIB are trademarks of Texas Instruments Incorporated.