SN74LVC2G66是TI公司的一款TI芯片产品，SN74LVC2G66是双模拟开关，本页介绍了SN74LVC2G66的产品说明、应用、特性等，并给出了与SN74LVC2G66相关的TI元器件型号供参考。
SN74LVC2G66 - 双模拟开关 - TI芯片 - 小尺寸逻辑器件 - TI公司（Texas Instruments，德州仪器）
- Available in the Texas Instruments NanoFree™ Package
- 1.65-V to 5.5-V VCC Operation
- Inputs Accept Voltages to 5.5 V
- Max tpd of 0.8 ns at 3.3 V
- High On-Off Output Voltage Ratio
- High Degree of Linearity
- High Speed, Typically 0.5 ns (VCC = 3 V, CL = 50 pF)
- Rail-to-Rail Input/Output
- Low ON-State Resistance, Typically ?6 Ω (VCC = 4.5 V)
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- Wireless Devices
- Audio and Video Signal Routing
- Portable Computing
- Wearable Devices
- Signal Gating, Chopping, Modulation or Demodulation (Modem)
- Signal Multiplexing for Analog-to-Digital and Digital-to-Analog Conversion Systems
This dual bilateral analog switch is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC2G66 device can handle both analog and digital signals. The SN74LVC2G66 device permits signals with amplitudes of up to 5.5 V (peak) to be transmitted in either direction.
NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.
Each switch section has its own enable-input control (C). A high-level voltage applied to C turns on the associated switch section.
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems.
| PART NUMBER | PACKAGE | BODY SIZE (NOM) |
|---|---|---|
| SN74LVC2G66DCT | SSOP (8) | 2.95 mm × 2.80 mm |
| SN74LVC2G66DCU | VSSOP (8) | 2.30 mm × 2.00 mm |
| SN74LVC2G66YZP | DSBGA (8) | 1.91 mm × 0.91 mm |
