SN74LVC2G66 - 双模拟开关

SN74LVC2G66是TI德州仪器公司的一款TI芯片产品，SN74LVC2G66是双模拟开关，本站介绍了SN74LVC2G66的封装应用图解、特点和优点、功能等，并给出了与SN74LVC2G66相关的TI元器件型号供参考。

SN74LVC2G66 - 双模拟开关 - TI芯片 - 小尺寸逻辑器件 - 德州仪器

产品特性

Available in the Texas Instruments NanoFree™ Package
1.65-V to 5.5-V VCC Operation
Inputs Accept Voltages to 5.5 V
Max tpd of 0.8 ns at 3.3 V
High On-Off Output Voltage Ratio
High Degree of Linearity
High Speed, Typically 0.5 ns (VCC = 3 V, CL = 50 pF)
Rail-to-Rail Input/Output
Low ON-State Resistance, Typically ?6 Ω (VCC = 4.5 V)
Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II

产品应用

Wireless Devices
Audio and Video Signal Routing
Portable Computing
Wearable Devices
Signal Gating, Chopping, Modulation or Demodulation (Modem)
Signal Multiplexing for Analog-to-Digital and Digital-to-Analog Conversion Systems

产品说明

This dual bilateral analog switch is designed for 1.65-V to 5.5-V VCC operation.

The SN74LVC2G66 device can handle both analog and digital signals. The SN74LVC2G66 device permits signals with amplitudes of up to 5.5 V (peak) to be transmitted in either direction.

NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.

Each switch section has its own enable-input control (C). A high-level voltage applied to C turns on the associated switch section.

Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems.

产品器件信息

PART NUMBER	PACKAGE	BODY SIZE (NOM)
SN74LVC2G66DCT	SSOP (8)	2.95 mm × 2.80 mm
SN74LVC2G66DCU	VSSOP (8)	2.30 mm × 2.00 mm
SN74LVC2G66YZP	DSBGA (8)	1.91 mm × 0.91 mm

下面可能是您感兴趣的TI德州仪器公司TI芯片元器件

TI公司产品现货专家，订购TI公司产品不限最低起订量，TI芯片大陆现货即时发货，香港库存3-5天发货，海外库存7-10天发货

寻找全球TI代理商现货货源 - TI公司（德州仪器）电子元件在线订购