The TLK3118 is a flexible, redundant XAUI serial transceiver that is compliant to 10-Gbps Ethernet XAUI specification. The TLK3118 provides high-speed bi-directional point-to-point data transmissions with up to 12.5 Gbps of raw data transmission capacity. The primary application of this device for use in backplanes and front panel connections requiring redundant 10Gbps connections over controlled impedance media of approximately 50 . The transmission media can be printed circuit board (PCB) traces, copper cables or fiber-optical media. The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise coupling into the lines.

The TLK3118 performs the parallel-to-serial, serial-to-parallel conversion, and clock extraction functions for a physical layer interface. The TLK3118 provides two complete XGXS/PCS functions defined in Clause 47/48 of the IEEE P802.3ae 10Gbps Ethernet standard. The serial transmitter is implemented using differential Current Mode Logic (CML) with integrated termination resistors.

The TLK3118 can be configured as a redundant XAUI transceiver or a full duplex XAUI re-timer. TLK3118 supports a 32-bit data path, 4-bit control, 10 Gigabit Media Independent Interface (XGMII) to the protocol device.

The TLK3118 supports the IEEE 802.3 defined Management Data Input/Output (MDIO) Interface to allow ease in configuration and status monitoring of the link. The bi-directional data pin (MDIO) should be externally pulled up to 2.5 V.

The TLK3118 supports the IEEE 1149.1 defined JTAG test port for ease in board manufacturing test. It also supports a comprehensive series of built-in tests for self-test purposes including PRBS generation and verification, CRPAT, CJPAT, Mixed/High/Low Frequency testing.

The TLK3118 operates with a 1.2-V core voltage supply, a 1.5-V HSTL I/O voltage supply and a 2.5-V bias supply. The device consumes 1.75 watts.

The TLK3118 is packaged in a 21x21mm, 400-ball, 1-mm ball pitch Flip Chip Ball Grid Array (FC-BGA) package and is characterized for operation from 0°C to 70°C, 105°C Junction, and 5% power supply variation unless noted otherwise.

• Redundant Quad 3.2-Gbps Transceiver Configurable as 10-Gbps Attachment Unit Interface (XAUI) Transceiver
• IEEE P802.3ae-2002 10 Gbps Ethernet XGXS (XGMII Extender Sublayer) Compliant
• Redundancy: Fast Switching from Primary to Secondary XAUI channel with Provisionable Error Character or Local Code Fault Insertion at Switch Time
• XAUI: Transmit Pre-Emphasis and Receive Adaptive Equalization to Allow Extended Backplane Reach
• Selectable Full Duplex XAUI Retimer Mode
• Support PRBS 27-1 and 223 -1 Generate/verify. Support Standard Defined CJPAT, CRPAT, High Freq, Low Freq, and Mixed Freq testing
• XGMII: HSTL Class 1 I/O with On-Chip 50- Termination on Inputs/Outputs
• XGMII: Source Centered Timing
• Supports Jumbo Packet (9600 byte maximum) Operation
• Align Character Skew Support of 40 bit times at Chip Pins
• MDIO: IEEE 802.3ae Clause 45 Compliant Management Data Input/Output Interface
• 1.2-V Core Voltage Supply, 1.5-V HSTL I/O Supply, and 2.5-V LVCMOS and Bias Supply
• JTAG: IEEE 1149.1 Test Interface
• Fabricated in Advanced 130-nm CMOS Technology
• Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch (1mm) PBGA