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TPS82698 - 产品图解：
TPS82698-700 mA、高效 MicroSiP 降压转换器（截面 <1mm）
TPS82698-非隔离式模块-电源模块-电源管理
TPS82698-高效MicroSiP(TM)降压转换器（厚度<1 mm） (Rev. B)
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TI产品 - TPS82698介绍

TPS82698 - 700 mA、高效 MicroSiP 降压转换器（截面 <1mm）

TPS82698是TI德州仪器公司的一款非隔离式模块产品，TPS82698是700 mA、高效 MicroSiP 降压转换器（截面 <1mm），本站介绍了TPS82698的封装应用图解、特点和优点、功能等，并给出了与TPS82698相关的TI元器件型号供参考。

TPS82698 - 700 mA、高效 MicroSiP 降压转换器（截面 <1mm） - 非隔离式模块 - 电源模块 - 德州仪器

产品特性
  • Total Solution Size <6.7 mm2
  • 95% Efficiency at 3MHz Operation
  • 23μA Quiescent Current
  • High Duty-Cycle Operation
  • Best in Class Load and Line Transient
  • ±2% Total DC Voltage Accuracy
  • Automatic PFM/PWM Mode Switching
  • Low Ripple Light-Load PFM Mode
  • Excellent AC Load Regulation
  • Internal Soft Start, 200-µs Start-Up Time
  • Integrated Active Power-Down Sequencing (Optional)
  • Current Overload and Thermal Shutdown Protection
  • Sub 1-mm Profile Solution
产品应用
  • Cell Phones, Smart-Phones
  • Optical Data Modules
  • Camera and Sensor Modules
  • Wearable Devices
  • LDO Replacement
产品说明

The TPS8269xSIP device is a complete 500mA / 800mA, DC/DC step-down power supply intended for low-power applications. Included in the package are the switching regulator, inductor and input/output capacitors. No additional components are required to finish the design. The TPS8269xSIP is based on a high-frequency synchronous step-down dc-dc converter optimized for battery-powered portable applications. The MicroSIP™ DC/DC converter operates at a regulated 3-MHz switching frequency and enters the power-save mode operation at light load currents to maintain high efficiency over the entire load current range. The PFM mode extends the battery life by reducing the quiescent current to 23μA (typ) during light load operation. For noise-sensitive applications, the device has PWM spread spectrum capability providing a lower noise regulated output, as well as low noise at the input. These features, combined with high PSRR and AC load regulation performance, make this device suitable to replace a linear regulator to obtain better power conversion efficiency. The TPS8269xSIP is packaged in a compact (2.3mm x 2.9mm) and low profile (1.0mm) BGA package suitable for automated assembly by standard surface mount equipment.

Device Information
ORDER NUMBERPACKAGEBODY SIZE
TPS82692SIPµSIP (8)2,9mm × 2,3mm
TPS82693SIPµSIP (8)2,9mm × 2,3mm
TPS826951SIPµSIP (8)2,9mm × 2,3mm
TPS82697SIPµSIP (8)2,9mm × 2,3mm
TPS82698SIPµSIP (8)2,9mm × 2,3mm
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